Earlier today, Samsung Foundry held its SAFE Forum 2026 event in South Korea. During the event, the company unveiled two new 2nm semiconductor fabrication processes, a new 1.4nm process node, and the mass production roadmap for its upcoming manufacturing technologies.Production timeline for Samsung’s third- and fourth-generation 2nm processesShin Jong-shin, Executive Vice President of Samsung Foundry’s Design Platform Development Office, revealed that development of SF1.4, Samsung’s first-generation 1.4nm process, is progressing smoothly. The company plans to begin mass production of chips based on this process in 2029. This information aligns with yesterday’s report.He also revealed that Samsung is already developing its second-generation 1.4nm process, SF1.4+, with mass production scheduled to begin in 2030.Samsung’s in-house Exynos 2600 processor, which powers the Galaxy S26 and Galaxy S26+ in select markets, was the first chip manufactured using the company’s SF2 (first-generation 2nm) process. Its successor, the Exynos 2700, which is expected to debut with the Galaxy S27 and Galaxy S27+ in 2027, will reportedly be built on the SF2P (second-generation 2nm) process.According to Shin, moving from SF2 to SF2P delivers up to 15% higher clock speeds and 26% better power efficiency. He said more than half of those gains come from Samsung’s Design Technology Co-Optimization (DTCO) approach, which optimizes both the chip’s design and manufacturing process at the same time in collaboration with chip design and EDA partners.First 1.4nm chips made by Samsung Foundry to debut in 2029Samsung originally planned to begin mass production of 1.4nm chips in 2027. However, the company postponed those plans by two years so it could focus on improving yields for its 2nm process. In comparison, Intel is expected to begin manufacturing chips on its 14A process (roughly equivalent to the 1.4nm class) in 2027, while TSMC’s 1.4nm process is expected to enter mass production in 2028.Samsung also revealed that it is developing SF2P+ and SF2X, its third- and fourth-generation 2nm process technologies, respectively. SF2X is specifically designed for high-performance computing (HPC) chips. Mass production using both SF2P+ and SF2X is expected to begin between 2027 and 2028.