Japan says progress made on $550B pact, with AI and chips weighing heavily on the next round

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Japan’s trade minister said discussions on AI and semiconductors will carry very significant weight in the third tranche of its $550B US investment pact, after two rounds went to energy and minerals. The EU’s own framework contains no comparable vehicle, and commits the bloc to buying at least $40B of US AI chips. Japan’s trade […]This story continues at The Next Web