Thermal throttling still remains a bottleneck. Performance takes a hit when the chipset gets too hot under intense load. While Samsung has made considerable advances in thermal management, room for improvement still remains. A new report out of South Korea claims that Samsung is looking into the use of an active liquid cooling system for future Galaxy phones.Air cooling is also under considerationSamsung has reportedly formed a dedicated research team at the Production Technology Research Institute which is looking at various active cooling techniques, including liquid cooling and air cooling. The liquid cooling system would cool down the device by circulating liquid that circulates in a sealed system inside the device.Park Min, the lab director at Samsung's Production Technology Research Institute, says that the team is focusing on liquid cooling through a structure that's connected directly on the chipset side. While air cooling is effective, the noise and weight of the cooling fan are downsides worth considering. Chinese OEM Nubia has developed a gaming smartphone that utilizes both liquid and air cooling. Others like Oppo and Vivo have launched models with active air cooling. So the implementation of these methods isn't merely theoretical. They're already a practical reality, one that Samsung should be able to achieve as well.Many Samsung devices already feature a vapor chamber cooling system. The company's latest flagship Exynos 2600 chipset also utilizes innovative Heat Pass Block technology that already makes it run cooler than the competing Snapdragon 8 Elite Gen 5 chipset.Thermal management will become more important in future flagship devices, as on-device AI and high performance chipsets would need to overcome this bottleneck to live up to their full potential. However, it remains a mystery right now which Samsung device these new cooling innovations will be introduced with.