TL;DRQualcomm’s newest connectivity system brings Wi-Fi 8 and Bluetooth 7 support to a revamped chip design with a 4×4 radio configuration.The Qualcomm FastConnect 8800 enables double-digit throughput and three times the range of current offerings.It’s possible that FastConnect 8800 could power connectivity in the Snapdragon 8 Elite Gen 6. For now, all we know is that this chip launches in consumer products starting in late 2026Wi-Fi 7 and Bluetooth 6 are just starting to become mainstream, but Qualcomm is already looking ahead to Wi-Fi 8 and Bluetooth 7 with its latest mobile connectivity chip. The company announced the Qualcomm FastConnect 8800 at MWC 2026 today, which is the first mobile offering to support Wi-Fi 8, Bluetooth 7, Ultra Wideband 802.15.4ab, and Thread 1.5 in the same chip. The Wi-Fi 8 era is officially upon us, with FastConnect 8800 products expected to launch later this year.Qualcomm’s FastConnect 8800 connectivity chip is built using a 6nm process node and a new 4×4 radio configuration. Compared to the standard 2×2 radio configuration found on chips like the FastConnect 7900, the 4×4 layout debuting on the FastConnect 8800 makes double-digit throughput possible, according to the company. It enables peak speeds of up to 11.6 Gbps and up to three times the range of current FastConnect chips.