Samsung's Exynos chips are infamous for their worse efficiency and heat management. However, the South Korean firm is trying new technologies to improve those aspects of its upcoming in-house chips. The Exynos 2600 chip, which will likely be used in some Galaxy S26 models, will reportedly use a newer thermal management technology.According to a report from ZDNet Korea, Samsung is planning to introduce a new chip packaging technology to improve the performance of the Exynos 2600 chip. The South Korean firm will reportedly use Heat Pass Block (HPB), which is a way of inserting heat-dissipating materials inside the semiconductor chip package.What is HPB that could be used in the Exynos 2600 for better heat management?The Exynos 2600 is a 2nm chip designed by Samsung's System LSI division and fabricated using Samsung Foundry. It will be the company's first chip to use Heat Pass Block (HPB), which is a copper-based heatsink that is placed on top of the application processor and DRAM. It will absorb the heat generated by CPU, GPU, RAM, and other sub-components that are usually found in modern smartphone system-on-chips (SoCs).Samsung reportedly plans to complete the testing of the Exynos 2600 by October of this year. If the results are satisfactory, the chip's mass production will start soon so that it can be ready to be placed inside Galaxy S26 series phones that will be launched in early 2026. Other models in the Galaxy S26 series, likely the Galaxy S26 Ultra, will likely use the Snapdragon 8 Elite Gen 2 chip made by Qualcomm.Over the past couple of years, Samsung has been using newer chip packaging technologies for Exynos chips. The Exynos 2400 used the Fan-Out Wafer Level Packaging (FOWLP) technology, which places the input and output (I/O) terminals outside the semiconductor chip, offering better heat dissipation. Instead of using a conventional printed circuit board (PCB), the chip is integrated onto a silicon wafer. The Exynos 2600 also uses FOWLP.The post Galaxy S26’s Exynos 2600 chip could have better heat management appeared first on SamMobile.