Samsung Electronics is reportedly revisiting plans to invest $7 billion in an advanced packaging (AP) plant for high-bandwidth memory (HBM) in the United States, according to the Korean Economic Daily. The proposed facility would be located adjacent to Samsung’s existing chip fab in Taylor, Texas, and would strengthen its position in the fast-growing AI chip supply chain.Meanwhile, SK Hynix is said to be considering the construction of a new DRAM production line in the U.S., potentially expanding its footprint beyond the advanced packaging facility planned for Indiana under the CHIPS Act.The moves reflect intensifying efforts by major South Korean chipmakers to bolster U.S.-based operations amid growing demand for AI semiconductors and strategic incentives from Washington to localize semiconductor supply chains. This article was written by Eamonn Sheridan at investinglive.com.