Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's biggest —floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM

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Intel Foundry has released a video of a multi-chiplet 2.5D/3D processor with a 10,296 mm^2 silicon footprint, including leading-edge technologies such as 14A and 18A.